From time to time the NASA Workmanship Technical Committee will publish or come across workmanship or process related technical studies or research papers. Where possible, this site will disseminate this information in an attempt to help some of you avoid pitfalls that may have been encountered by others. If you wish to contribute to this page, please contact us.

Disclaimer: We strive very hard to be sure that anything posted on this page is supported by objective data. However, as with any hardware application, but especially in the unique and varied environments space flight hardware must operate, not all of these topics or processes are appropriate for every situation. Please review carefully before you decide whether or not to use any of this information for your program.

• NASA Electronic Parts and Packaging Program's Tin Whisker Research
• Effects of Solder Rework on Plated Through Holes in Multilayer Printed Wiring Boards (PDF) (NOTE : Our apologies to the authors and readers. As a result of converting this file, a formula is shown as garbled data on page 5. Everything else is presented correctly. A corrected version of this study will be posted in the near future.)
• Tantalum Capacitor Vibration Test (PDF)
• ESD Effects During Removal of Conformal Coatings Using Micro Abrasive Blasting (PDF)
• Magellan Solder Joint Failure (PDF)
• Close the Information Gap on IC Package Reliability (PDF)
• CSP Implementation Challenges (PDF)