- INTRODUCTION
- SECTION 1 WIRE PREPARATION
%20- 1.01 - General Requirements
- 1.02 - Mechanical Stripping
- 1.03 - ELA and Thermal Stripping
- 1.04 - Chemical Stripping
- SECTION 2 CRIMPED TERMINATIONS
- 2.01
- General Requirements
- 2.02
- Crimp Pins & Sockets
- 2.03 - Multiple Crimp Pins & Sockets
- 2.04 -
Blade/Pin Terminals
- 2.05
- Ring Lug Terminals
- 2.06
- Spade Lug Terminals
- 2.07 - Butt Splices
- 2.08 - End Splices
- 2.09 - Parallel
Splices
- 2.10 - Shield
Crimps
- SECTION 3 DISCRETE WIRING
- 3.01 - Solderless
Wrapped Electrical Connections-Wire Wrap
- 3.02 - Jumper Wires
- 3.03 - Deadbugs
- SECTION 4 CABLES AND HARNESS
- 4.01
- General Requirements
- 4.02
- Discrete Conductor
- 4.03 - Multi-Conductor
Cable
- 4.04 - Coaxial Cable
- 4.05 - Flat/Ribbon
Cable
- 4.06 - Solder Sleeves
- 4.07 - Splices
- SECTION 5 PRINTED WIRING BOARD (PWB)
- 5.01
- General Requirements
- 5.02 - Rigid
Laminate
- 5.03 - Flexible
Laminate
- 5.04
- Rigid-Flexible Laminate
- SECTION 6 THROUGH-HOLE SOLDERING (PWB)
- 6.01
- General Requirements
- 6.02
- Preparation of Conductors
- 6.03
- Mechanical Assembly-Hardware
- 6.04
- Mechanical Assembly-Power Semiconductors & Heatsinks
- 6.05
- Mechanical Assembly-Swaged Terminals
- 6.06
- Mechanical Assembly-Component Support, Mechanical
- 6.07 -
Soldered Connectors
- 6.08
- Solderless (Press-Fit) Connectors
- 6.09 - Axial
Components
- 6.10 - Radial
Components
- 6.11
- Component Installation-Dual In-Line Packages (DIPS)
- 6.12
- Single In-Line Package (SIP)
- 6.13 - Terminals
- 6.14 - Solder
Cups
- 6.15 - Discrete
Wires
- 6.16
- Service Lead Splices
- 6.17
- High-Voltage Terminations
- SECTION 7 SURFACE MOUNT TECHNOLOGY (SMT)
- 7.01
- General Requirements
- 7.02
- Solder Paste/Solder Preform Application
- 7.03
- Adhesive Application
- 7.04
- Chip Components/Bottom-Only Terminations
- 7.05
- Chip Components-Rectangular/Square End Terminations
- 7.06
- Metallized Electrode Face (MELF)
- 7.07
- Gull-Wing/"L" Leaded Packages
- 7.08
- Butt "I" Leaded Packages
- 7.09 -
"J" Leaded Packages
- 7.10
- Inward-Formed "L" Leaded Packages
- 7.11
- Leaded Packages/Parts Round or Flattened (Coined) Leads.
- 7.12
- Leadless Chip Carriers (LLCC)
- 7.13
- Ball Grid Array (BGA)
- SECTION 8 CONFORMAL COATING AND STAKING (BONDING)
- 8.01
- General Requirements
- 8.02
- Adhesive Bonding/Staking
- 8.03 - Conformal
Coating
- SECTION 9 POLYMERIC SYSTEMS
- 9.01
- General Requirements
- SECTION 10 FIBER OPTICS
- 10.01
- General Requirements
- 10.02
- Fiber Optic Assemblies
- 10.03
- Fiber Optic Cable Assemblies
- SECTION 11 ELECTROSTATIC DISCHARGE (ESD)
- 11.01
- General Requirements
- APPENDIX
- DEFINITIONS