THROUGH-HOLE SOLDERING
SINGLE IN-LINE PACKAGE (SIP)
single inline packages
SINGLE IN-LINE PACKAGE (SIP)

Single-In-Line Package (SIP) components have a flat body oriented vertically to the printed wiring board and a single row of pins or leads. Most small-form SIPs are parallel-array devices of common value components (i.e. diode, resister arrays). Large-form SIPs are usually hybrid circuits (i.e. timers, oscillators, etc.). The SIP body can be either plastic or ceramic with between 4 to 64 leads.

See Section 6.01 "Through-Hole Soldering, General Requirements", for common accept/reject criteria.
single inline package partially clinched leads

PREFERRED

The component has been properly oriented and all leads are fully inserted in the termination holes with the lead standoff step in contact with the lands. The component body is undamaged and part markings are legible and visible.

ACCEPTABLE

PARTIALLY CLINCHED LEADS

The end leads may be partially clinched to temporarily secure the component. Clinching shall not violate minimum electrical spacing requirements, or adversely affect solderability.

Best Workmanship Practice
orientation of component with silkscreen improper orientation of component with silkscreen

ACCEPTABLE

ORIENTATION/POLARITY

The component has been properly installed. The chip's notch/paint stripe, which identifies pin 1, is lined up with the silkscreen pattern. A square-shaped solder pad on the printed wiring pattern may also be used to identify pin 1.

NASA-STD-8739.3 [8.1]

UNACCEPTABLE

IMPROPER ORIENTATION/POLARITY

The SIP has been installed backwards. The locator notch/dimple, which identifies pin 1 of the chip, should be lined up to the silkscreen and/or conductive pattern marks.

NASA-STD-8739.3 [13.6.2.a.5]
NASA WORKMANSHIP STANDARDS
NASA logo Released:
06.27.2002 		Revision:
 		Revision Date:
Book:
6 		Section:
6.12 		Page:
1




THROUGH-HOLE SOLDERING
SINGLE IN-LINE PACKAGE (SIP) (cont.)
tilt of component excess tilt of component

ACCEPTABLE

TILT

The component exhibits minor tilting, but the tilt does not reduce lead protrusion below acceptable minimums, cause the component body to exceed height requirements, or violate minimum electrical spacing requirements.

NASA-STD-8739.3 [8.1], [13.6.1]

UNACCEPTABLE

EXCESS TILT

Excess part tilt causes the leads to not meet minimum protrusion requirements. Excess tilt may cause the part to exceed maximum height requirements, or result in violation of minimum electrical clearance requirements.

NASA-STD-8739.3 [13.6.2.a.21]
curled lead improper orientation

UNACCEPTABLE

BENT/CURLED LEAD

The lead has been smashed into the pad surface, preventing proper insertion. This may be caused by improper lead planarity, an improperly bent lead, or a solder-plugged hole.

NASA-STD-8739.3 [13.6.2.a.7], [13.6.2.a.21]

UNACCEPTABLE

IMPROPER ORIENTATION/OFFSET

The component has been incorrectly installed, with the chip offset with respect to the intended termination pattern.

NASA-STD-8739.3 [13.6.2.a.5]
pistoned lead

UNACCEPTABLE

PISTONED LEAD

The lead has been displaced vertically (pistoned) during insertion. This may be caused by improper lead planarity, an improperly bent lead, or a solder-plugged hole.

NASA-STD-8739.3 [13.6.2.a.7], [13.6.2.a.21]
NASA WORKMANSHIP STANDARDS
NASA logo Released:
06.27.2002 		Revision:
 		Revision Date:
Book:
6 		Section:
6.12 		Page:
2





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