THROUGH-HOLE SOLDERING SOLDER CUPS

THROUGH-HOLE SOLDERING SOLDER CUPS
	SOLDER CUPS Solder cup terminals are primarily designed for the in-line solder termination of conductors. This style of terminal is principally designed as a precision-machined pin for insertion into connector bodies. Variations include connectors in which the solder cup pin is captive in the connector body (i.e.: hermetic connectors), or printed wiring board mounted terminals designed for discrete wire terminations. See Section 6.01 "Through-Hole Soldering, General Requirements", for common accept/reject criteria.

PREFERRED INTERIM ASSEMBLY The wire has been inserted straight into the cup, is in contact with the back wall for the full depth of the cup and bottoms in the cup. The assembly exhibits proper insulation gap and the cup interior has been pretinned. NASA-STD-8739.3 [9.6]	PREFERRED COMPLETED ASSEMBLY The solder shall form a fillet between the conductor and the cup entry slot, and shall follow the contour of the cup opening. NASA-STD-8739.3 [10.2.3]

ACCEPTABLE MAXIMUM SOLDER The solder quantity is the maximum acceptable, but does not spill over (exceed the diameter of the cup), or exhibit a convex profile. NASA-STD-8739.3 [10.2.3.b]	UNACCEPTABLE EXCESS SOLDER The solder does follow the contour of the cup opening and spills over (exceeds the diameter of the cup) with a convex profile. NASA-STD-8739.3 [10.2.3.a], [13.6.2.b.6]

NASA WORKMANSHIP STANDARDS
	Released: 06.27.2002	Revision:	Revision Date:
	Book: 6	Section: 6.14	Page: 1

THROUGH-HOLE SOLDERING SOLDER CUPS (cont.)

ACCEPTABLE MINIMUM SOLDER The solder quantity is sufficient to follow the contour of the cup opening. The termination is fully wetted with complete, slightly concave, fillets between the wire and the cup wall. Solder fill is at least 75%. NASA-STD-8739.3 [10.2.3.a]	UNACCEPTABLE INSUFFICIENT SOLDER QUANTITY The solder quantity is insufficient to follow the contour of the cup opening. The termination is fully wetted, but exhibits incomplete fillets along the conductor. Solder surface is not visible in bottom of cup. NASA-STD-8739.3 [10.2.3.a], [13.6.2.b.7]

ACCEPTABLE MULTIPLE TERMINATIONS The maximum number of conductors that can be inserted into the cup is limited to those that can be in contact with the full height of the back wall of the cup. All wires shall exhibit proper insulation gaps, but do not need to exhibit equal gaps. NASA-STD-8739.3 [9.6]	UNACCEPTABLE EXCESSIVE CONDUCTORS The number of conductors inserted exceeds the number than can be in contact with the full height of the back wall of the cup. NASA-STD-8739.3 [9.6]

ACCEPTABLE SPILLAGE Solder along the outside of the cup (spillage) is acceptable, provided the solder deposit approximates tinning and does not interfere with the form, fit or function of the connector. NASA-STD-8739.3 [10.2.3.b]	UNACCEPTABLE SPILLAGE The solder deposit interferes with the form, fit or function of the connector. NASA-STD-8739.3 [10.2.3.b], [13.6.2.b.6]

NASA WORKMANSHIP STANDARDS
	Released: 06.27.2002	Revision:	Revision Date:
	Book: 6	Section: 6.14	Page: 2

THROUGH-HOLE SOLDERING
SOLDER CUPS (cont.)

improper installation

UNACCEPTABLE

IMPROPER INSTALLATION

The wire has been inserted for the full depth, but is not in contact with the back wall of the cup.

NASA-STD-8739.3 [9.6], [13.6.2.a.5]

NASA WORKMANSHIP STANDARDS
	Released: 06.27.2002	Revision:	Revision Date:
	Book: 6	Section: 6.14	Page: 3


Need a printed copy? (May take a while to load.) Requires Adobe Reader.	Need Adobe Reader? Click here to download.	Questions? Suggestions?