THROUGH-HOLE SOLDERING HIGH VOLTAGE TERMINATIONS | |
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High-voltage terminations, where coronal suppression is necessary, will require special design. All aspects of the soldered joints shall be covered by smooth fillets, free of discontinuities or severe change in surface contour (i.e. sharp edges, points, angles, etc.). |
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PREFERRED The solder connection has a completely rounded, continuous and smooth profile. No evidence of sharp edges, points, icicles, inclusions (foreign material) or wire strands. Insulation clearance is as close to the solder connection as possible without embedment. NASA-STD-8739.3 [10.3] |
PREFERRED FLARED FLANGE (TERMINAL) All edges of the terminal flange are completely covered with a continuous, smooth layer of solder to form a solder ball. The balled connection does not exceed specified height requirements. Best Workmanship Practice |
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PREFERRED INSULATION CLEARANCE The insulation gap is minimal, with the insulation as close to the solder connection as practical without embedment or damage. NASA-STD-8739.3 [9.1.1] |
PREFERRED THROUGH HOLE TERMINATION All sharp edges of the component lead end are completely covered with a continuous, smooth, rounded layer of solder to form a solder ball. The balled connection does not exceed specified height requirements. Best Workmanship Practice |
NASA WORKMANSHIP STANDARDS | |||
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Released: 06.27.2002 |
Revision: |
Revision
Date: |
Book: 6 |
Section: 6.17 |
Page: 1 |
THROUGH-HOLE SOLDERING HIGH VOLTAGE TERMINATIONS (cont.) | |
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ACCEPTABLE INSULATION CLEARANCE (C) The insulation gap (C) is less than two insulated wire diameters (D). NASA-STD-8739.3 [9.1.2] |
UNACCEPTABLE IMPROPER INSULATION CLEARANCE (C) The insulation gap (C) is greater than two insulated wire diameters, which may result in coronal formation and short circuits. NASA-STD-8739.3 [9.1.2], [13.6.2.a.2] |
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ACCEPTABLE INSULATION CLEARANCE (C) The insulation gap (C) is less than one insulated wire diameter (D), but is not embedded in the solder joint. NASA-STD-8739.3 [9.1.1] |
ACCEPTABLE SOLDER CUP TERMINATIONS The connection has an egg-shaped, spherical, or oval profile following the contour of the terminal and wire wrap. No evidence of sharp edges, points, icicles, inclusions (foreign material), or wire strands. Insulation clearance is acceptable. NASA-STD-8739.3 [10.3] |
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ACCEPTABLE UNUSED TERMINAL All sharp edges of the terminal are completely covered with a smooth, continuous ball of solder. Best Workmanship Practice |
UNACCEPTABLE UNUSED TERMINAL All sharp edges of the terminal shall be completely covered with a smooth, continuous ball of solder. Best Workmanship Practice |
NASA WORKMANSHIP STANDARDS | |||
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Released: 06.27.2002 |
Revision: |
Revision
Date: |
Book: 6 |
Section: 6.17 |
Page: 2 |
THROUGH-HOLE SOLDERING HIGH VOLTAGE TERMINATIONS (cont.) | |
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ACCEPTABLE TERMINALS/WIRE LEAD The connection has an egg-shaped, spherical or oval profile that follows the contour of the terminal and wire wrap. No evidence of sharp edges, points, icicles, inclusions (foreign material), or wire strands. Insulation clearance is acceptable. NASA-STD-8739.3 [10.3] |
UNACCEPTABLE SHARP EDGES The solder follows the contour of the terminal and wrap, BUT there is evidence of the sharp edge of the terminal protruding through the solder surface. NASA-STD-8739.3 [10.3] |
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ACCEPTABLE UNUSED SOLDER CUPS The solder connection has an egg-shaped, spherical or oval profile. No evidence of sharp edges, points, icicles, inclusions (foreign material) or wire strands. Best Workmanship Practice |
UNACCEPTABLE UNUSED TERMINAL, SHARP EDGES The solder is continuous, BUT there is evidence of solder peaks, icicles or sharp turret edges protruding. Best Workmanship Practice |
NASA WORKMANSHIP STANDARDS | |||
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Released: 06.27.2002 |
Revision: |
Revision
Date: |
Book: 6 |
Section: 6.17 |
Page: 3 |
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