 |
ALL
BY TECHNOLOGY
|
| |
SOLDERING |
| |
NASA-STD-8739.2 |
Surface
Mount Technology |
Initial |
August
1999 |
| |
NASA-STD-8739.3 |
Soldered
Electrical Connections |
Change
2 |
January
2001 |
| |
J-STD-004 |
Requirements for Soldering Fluxes |
Rev A |
January
2004 |
| |
J-STD-005 |
Requirements
for Soldering Paste |
Amndmt.1 |
January
1995 |
| |
J-STD-006 |
Requirements
for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid
Solders for Electonic Soldering Applications |
Rev B |
January
2006 |
| |
|
|
|
|
| |
PRINTED
WIRING BOARDS |
| |
DESIGN |
|
|
|
| |
IPC-2221 |
Generic
Standard on Printed Wiring Board Design |
Rev A
|
May 2003 |
| |
IPC-2222 |
Sectional Standard on Rigid Printed Wiring Board Design |
Initial
Release |
February
1998 |
| |
FABRICATION |
|
|
|
| |
IPC-6011 |
Generic
Performance Specifications for Printed Boards |
Initial
Release |
July
1996 |
| |
IPC-6012 |
Qualification
and Performance Specification for Rigid Printed Boards |
B |
August
2004 |
| |
IPC-A-600 |
Guidelines
for Acceptability of Printed Boards |
G |
July
2004 |
| |
|
|
|
|
| |
WIRING/HARNESSING |
| |
NASA-STD-8739.4 |
Crimping,
Interconnecting Cables, Harnesses, and Wiring |
Change 3 |
September 2006 |
| |
|
|
|
|
| |
FIBER
OPTICS |
| |
NASA-STD-8739.5 |
Fiber
Optics Terminations, Cable Assemblies, and Installation |
Initial |
February
1998 |
| |
|
|
|
|
| |
POLYMERICS
(conformal coating, staking, potting, bonding, etc) |
| |
NASA-STD-8739.1 |
Workmanship
Standard for Staking and Conformal Coating of Printed Wiring Boards
and Electronic Assemblies |
Initial |
August
1999 |
| |
|
|
|
|
| |
Electrostatic
Discharge Control |
| |
ANSI/ESD
S20.20-2007 |
Protection
of Electrical and Electronic Parts, Assemblies and Equipment (Excluding
Electrically Initiated Explosive Devices) |
2007 |
February
2007 |
| |
NASA-STD-8739.7 |
Electrostatic
Discharge Control (Excluding Electrically Initiated Explosive Devices) |
Cancelled
2/29/2002 |
|
