Printed Wiring Assemblies (PWAs)

	1. Bubbles in conformal coating under FPGA
	2. Chlorine contamination
	3. Conformal coating non-wetting
	4. Excessive staking
	5. Fatigue fracture - no mechanical support
	6. Fiber contamination in conformal coating.
	7. Improper modification of solder lug causing short
	8. Improper use of removal tool
	9. Improper cover installation causing lifted pad
	10. Insufficient/wrong type of staking material
	11. Lack of staking material causing lead breakage
	12. Lack of stress relief
	13. Possible shorting potential resulting from contamination
	14. Solder cup cold solder joint failure
	15. Staking compound negating stress relief
	16. Staking failure on tantalum capacitor
	17. Vibration-induced failure of electric component leads
	18. Wavesolder process problem

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