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Printed Wiring Assemblies (PWAs)
Lack of Stress Relief
This device failed after environmental testing as
a result of not having any stress relief on the leads.
Remounting of the part incorporating the proper stress
relief was required.
Reference
:
NASA-STD-8739.3,
4.3. Reliable Soldered Connections
2. The following requirements and design objectives
should be used to ensure the reliable soldered connections
required by NASA:
a. Stress relief should be inherent in the design to
avoid detrimental thermal and mechanical stresses on
the solder connections.
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