INTRODUCTION

SECTION 1 WIRE PREPARATION
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1.01 - General Requirements
1.02 - Mechanical Stripping
1.03 - ELA and Thermal Stripping
1.04 - Chemical Stripping
SECTION 2 CRIMPED TERMINATIONS
2.01 - General Requirements
2.02 - Crimp Pins & Sockets
2.03 - Multiple Crimp Pins & Sockets
2.04 - Blade/Pin Terminals
2.05 - Ring Lug Terminals
2.06 - Spade Lug Terminals
2.07 - Butt Splices
2.08 - End Splices
2.09 - Parallel Splices
2.10 - Shield Crimps
SECTION 3 DISCRETE WIRING
3.01 - Solderless Wrapped Electrical Connections-Wire Wrap
3.02 - Jumper Wires
3.03 - Deadbugs
SECTION 4 CABLES AND HARNESS
4.01 - General Requirements
4.02 - Discrete Conductor
4.03 - Multi-Conductor Cable
4.04 - Coaxial Cable
4.05 - Flat/Ribbon Cable
4.06 - Solder Sleeves
4.07 - Splices
SECTION 5 PRINTED WIRING BOARD (PWB)
5.01 - General Requirements
5.02 - Rigid Laminate
5.03 - Flexible Laminate
5.04 - Rigid-Flexible Laminate
SECTION 6 THROUGH-HOLE SOLDERING (PWB)
6.01 - General Requirements
6.02 - Preparation of Conductors
6.03 - Mechanical Assembly-Hardware
6.04 - Mechanical Assembly-Power Semiconductors & Heatsinks
6.05 - Mechanical Assembly-Swaged Terminals
6.06 - Mechanical Assembly-Component Support, Mechanical
6.07 - Soldered Connectors
6.08 - Solderless (Press-Fit) Connectors
6.09 - Axial Components
6.10 - Radial Components
6.11 - Component Installation-Dual In-Line Packages (DIPS)
6.12 - Single In-Line Package (SIP)
6.13 - Terminals
6.14 - Solder Cups
6.15 - Discrete Wires
6.16 - Service Lead Splices
6.17 - High-Voltage Terminations
SECTION 7 SURFACE MOUNT TECHNOLOGY (SMT)
7.01 - General Requirements
7.02 - Solder Paste/Solder Preform Application
7.03 - Adhesive Application
7.04 - Chip Components/Bottom-Only Terminations
7.05 - Chip Components-Rectangular/Square End Terminations
7.06 - Metallized Electrode Face (MELF)
7.07 - Gull-Wing/"L" Leaded Packages
7.08 - Butt "I" Leaded Packages
7.09 - "J" Leaded Packages
7.10 - Inward-Formed "L" Leaded Packages
7.11 - Leaded Packages/Parts Round or Flattened (Coined) Leads.
7.12 - Leadless Chip Carriers (LLCC)
7.13 - Ball Grid Array (BGA)
SECTION 8 CONFORMAL COATING AND STAKING (BONDING)
8.01 - General Requirements
8.02 - Adhesive Bonding/Staking
8.03 - Conformal Coating
SECTION 9 POLYMERIC SYSTEMS
9.01 - General Requirements
SECTION 10 FIBER OPTICS
10.01 - General Requirements
10.02 - Fiber Optic Assemblies
10.03 - Fiber Optic Cable Assemblies
SECTION 11 ELECTROSTATIC DISCHARGE (ESD)
11.01 - General Requirements

APPENDIX

DEFINITIONS